Chipstick D4 Glue - TDS

Chipstick D4 Glue - MSDS

Installation Guide - New Build Flooring

• D4 water resistance per DIN EN 204/205 and BS EN 204:2016, the top class for non-structural wood adhesives
• Coverage: around 5 boards of 22 mm chipboard per 1 kg bottle
• Foaming action expands into voids; the ridge scrapes off cleanly after cure
• Thermal resistance once cured: -40 °C to +100 °C
• Bonds wood, chipboard, OSB, metals, stone, concrete, polystyrene foam, glass wool, rock wool, PU foam and several plastics for interior or exterior use
• Open time 20 to 28 minutes at 23 °C / 50% RH, full cure in 24 hours
• One component, 99% solid content, no mixing required
• Same bottle stops squeaky floors: apply a bead to the joist, reinstall the board, scrape excess after cure

First, make sure both surfaces are dry, clean and free from dust and grease. Then lightly moisten one substrate, because the foaming PU cures on ambient moisture.

Next, apply adhesive to the other face, using a spreader if needed. Then bring the parts together immediately with firm pressure and no movement. The substrates must stay in contact during the curing process.

After that, maintain pressure for 60 to 90 minutes at 20 °C, then leave the joint to reach full cure at 24 hours. Open time at 23 °C and 50% RH is 20 to 28 minutes, so plan your spread and lay-down rate around that window.

For squeaky floors, lift the floorboard, run a bead of Chipstick D4 along the joist, and reinstall the board. The foaming action fills voids between the joist and the board, locking the joint. Finally, scrape excess adhesive off once cured.

• Product code: SP7000CS-1KG-1
• Size: 1 kg single bottle (also Twin Pack 2 x 1 kg, Five Pack 5 x 1 kg, 12 Bottles in a Box, 60 Bottles in 5 Boxes)
• Colour: brown
• Standard: D4 water resistance per DIN EN 204/205 and BS EN 204:2016
• Solid content: 99%
• Viscosity at 25 °C: 3,600 to 4,600 mPas
• Density: 1,165 to 1,185 g/cm³
• Open time (23 °C, 50% RH): 20 to 28 minutes
• Pressure time at 20 °C: 60 to 90 minutes
• Full cure time: 24 hours
• Temperature resistance (cured): -40 °C to +100 °C
• Application temperature: +5 °C to +25 °C
• Coverage: around 5 boards of 22 mm chipboard per 1 kg bottle
• Bonds: wood, chipboard, OSB, metals, stone, concrete, polystyrene foam, glass wool, rock wool, PU foam and several plastics (interior or exterior)
• Shelf life: 12 months in original, unopened packaging at +5 °C to +25 °C
• Product Downloads: TDS, MSDS and Installation Guide PDFs available on the product page

What does the D4 rating mean for chipboard flooring adhesive?

D4 is the top water resistance class in EN 204, the European standard for non-structural wood adhesives. Chipstick D4 meets EN 204 D4 per DIN EN 204/205 and BS EN 204:2016, so the bond resists frequent exposure to running or condensed water and high humidity. That makes it suitable for chipboard flooring in kitchens, bathrooms and any room where moisture is a concern, indoors and outdoors.

How much area does a 1 kg bottle of Chipstick D4 cover?

STICK2 quotes approximately 5 boards of 22 mm chipboard flooring per 1 kg bottle. For other board thicknesses, check the linked Chipstick D4 TDS on the product page. Coverage drops on rough joist tops, so keep a spare bottle for awkward areas. Bulk packs of 2, 5, 12 and 60 bottles are available for bigger jobs.

How long does Chipstick D4 take to cure?

Apply pressure for 60 to 90 minutes at 20 °C, then leave the joint to reach full cure at 24 hours. Open time at 23 °C and 50% relative humidity is 20 to 28 minutes, so plan your spread and lay-down rate around that window. Foaming PU cures faster in warmer, more humid conditions and slower in cold workshops.

Can Chipstick D4 stop squeaky floors?

Yes. Lift the floorboard, apply a bead of Chipstick D4 along the joist, then reinstall the board. The foaming action fills voids between the joist and the underside of the board, locking the joint and removing the movement that causes the squeak. Excess adhesive scrapes off cleanly after cure.

What temperature range does the cured glue handle?

Once cured, Chipstick D4 holds its bond from -40 °C up to +100 °C. That covers indoor flooring, unheated outbuildings and exterior assemblies. Apply the adhesive itself at substrate and ambient temperatures between +5 °C and +25 °C; outside that window the cure timing and bond development may not match the TDS figures.

What surfaces will Chipstick D4 bond?

STICK2 lists wood, chipboard, OSB, metals, stone, concrete, polystyrene foam, glass wool, rock wool, PU foam and several plastics for interior or exterior use. The main application is chipboard flooring to timber joists, but the same bottle handles related construction bonds on site, from SIPS sandwich panel work to wooden staircases.